SiC Wafer Laser Cutting Machine
SiC WAFER LASER CUTTING MACHINE
SiC wafer laser cutting machine, based on silicon carbide substrate, adopts ultrafast picosecond laser to develop high-precision and high-efficiency cutting equipment. Customized laser system can cut all kinds of transparent and brittle materials in corresponding wave bands, such as silicon carbide, sapphire, silicon and glass, which has been widely used in semiconductor wafer, LED wafer and filter processing.
ADVANTAGES
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01
Strong compatibility
Fully automatic and compatible 4/6 inch sheet production.
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02
Stable and reliable
The picosecond laser designed for SiC material has stable processing effect.
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03
High accuracy
It is equipped with FDC automatic focus follow system, adjusts the cutting position in real time with high precision and compatibility of ± 15 μm slice thickness error.
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04
Fixed focus strength
It has the functions of automation focusing and calibration level.
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05
Anti-seismic capability
Professional shock absorption design, strong seismic resistance and high machine stability.
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06
Small model
Small machine needs a small area.
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