Dicing Saw
Fully Automatic Dicing Saw
Dicing saw developed by MEGAROBO can be widely used in various semiconductor processing scenarios such as wafers, ceramics, silicon wafers, glass, PCB, lithium niobate, alumina, quartz, etc.
ADVANTAGES
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Fully Automatic Dicing Saw
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Semi-automatic Dicing Saw
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Multiple sizes available
Mainstream 8", 12" ceramic table(Optional) .
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High standards
Comply with international standards, high precision design.
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High configuration
Standard image recognition.
Standard NCS (non-contact setup) function.
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User-friendly interface
Applicable to 8" to 12" wafers with user-friendly and easy-to-use UI interface.
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Various optional functions
Optional BBD (Blade Breakage Detection) function.
Optional kerf-check.
Optional multi-workpiece cutting, auto dressing, 12 inch square table and other functions.
Optional UV system.
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Multiple sizes available
8 inch + 12 inch and various types of square workpieces.
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User-friendly interface
User-friendly and easy to operate.
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High production efficiency
The UPH of the industry's highest standard.
Spindle power:1.8kW (2.4kW optional) .
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Flexibility and customization
The machine can be flexibly modified according to the personalized needs of customers.
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High precision design
International standard, world-class high-precision design.
Y-spindle positioning accuracy: 0.003mm/305mm.
Z-spindle repeated accuracy: 0.001mm.
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Independent R&D of core components
Independently develop the core components related to the processing and continuously improve the performance.
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